Literature DB >> 19908792

Low damage atomic layer etching of ZrO2 by using BCl3 gas and ar neutral beam.

W S Lim1, J B Park, J Y Park, B J Park, G Y Yeom.   

Abstract

This study examined the etch characteristics of ZrO2 etched using an atomic layer etching (ALET) system with BCl3 gas for adsorption and an Ar neutral beam for desorption. The effect of the BCl3 gas pressure and Ar neutral beam dose on the etch characteristics was examined. The results showed that the ZrO2 etch rate was maintained at a constant etch rate of 1.07 angstroms/cycle at a BCl3 gas pressure > 0.15 mTorr and an Ar beam flux > 1.485 x 1016 atoms/cm2 x cycle. Under these constant etch rate conditions, the surface roughness of the etched ZrO2 was similar to that of the as-received ZrO2. The surface composition of ZrO2 etched by ALET was compared with that etched by BCl3 inductively coupled plasma (ICP). The surface composition of ZrO2 etched by ALET showed a similar composition to that of the as-received ZrO2 while that etched by BCl3 ICP showed a Zr-rich surface.

Entities:  

Year:  2009        PMID: 19908792     DOI: 10.1166/jnn.2009.1748

Source DB:  PubMed          Journal:  J Nanosci Nanotechnol        ISSN: 1533-4880


  1 in total

1.  Mechanism of Thermal Atomic Layer Etch of W Metal Using Sequential Oxidation and Chlorination: A First-Principles Study.

Authors:  Suresh Kondati Natarajan; Michael Nolan; Patrick Theofanis; Charles Mokhtarzadeh; Scott B Clendenning
Journal:  ACS Appl Mater Interfaces       Date:  2020-07-28       Impact factor: 9.229

  1 in total

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