Literature DB >> 18691811

The reuse of nonmetals recycled from waste printed circuit boards as reinforcing fillers in the polypropylene composites.

Yanhong Zheng1, Zhigang Shen, Chujiang Cai, Shulin Ma, Yushan Xing.   

Abstract

The feasibility of reusing nonmetals recycled from waste printed circuit boards (PCBs) as reinforcing fillers in the polypropylene (PP) composites is studied by using both mechanical and vicat softening temperature (VST) tests. The concentration of Cu leaded from the composites is also tested. The mechanical test shows that both tensile and flexural properties of the nonmetals/PP composites can be significantly improved by adding the nonmetals into PP. The maximum increment of tensile strength, tensile modulus, flexural strength and flexural modulus of the PP composites is 28.4%, 62.9%, 87.8% and 133.0%, respectively. As much as 30 wt% nonmetals recycled from waste PCBs can be added in the PP composites without violating the environmental regulation. The VST test shows that the presence of nonmetals can improve the heat resistance of the nonmetals/PP composites for their potential applications. The optimum particle is the fine or medium nonmetals recycled from waste PCBs, and the optimum content of the nonmetals is 30 wt% basing on the comprehensive consideration. All the above results indicate that the reuse of nonmetals as reinforcing fillers in the PP composites represents a promising way for recycling resources and resolving the environmental pollutions.

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Year:  2008        PMID: 18691811     DOI: 10.1016/j.jhazmat.2008.07.008

Source DB:  PubMed          Journal:  J Hazard Mater        ISSN: 0304-3894            Impact factor:   10.588


  2 in total

1.  Recycling Waste Nonmetallic Printed Circuit Boards for Polyvinyl Chloride Composites.

Authors:  Aung Kyaw Moe; Jirasuta Chungprempree; Jitima Preechawong; Pornsri Sapsrithong; Manit Nithitanakul
Journal:  Polymers (Basel)       Date:  2022-08-28       Impact factor: 4.967

Review 2.  A review of the recycling of non-metallic fractions of printed circuit boards.

Authors:  André Canal Marques; José-María Cabrera Marrero; Célia de Fraga Malfatti
Journal:  Springerplus       Date:  2013-10-09
  2 in total

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