| Literature DB >> 17946999 |
Sohee Kim1, Richard A Normann, Reid Harrison, Florian Solzbacher.
Abstract
One requirement of a chronically implantable, wireless neural interface device is the integration of electronic circuitry with the microelectrode array. Since the electronic IC dissipates a certain amount of power, it will affect the temperature in the tissues surrounding the implant site. In this paper, the thermal influence of an integrated, 3-dimensional Utah electrode array, to be implanted in the brain was investigated with simulations using the finite element method (FEM). A temperature increase in the brain tissue was predicted using preliminary simulations with simplified models. The model and method used in the simulations were verified by simple in vitro experiments.Mesh：
Year: 2006 PMID： 17946999 DOI： 10.1109/IEMBS.2006.260307
Source DB: PubMed Journal: Conf Proc IEEE Eng Med Biol Soc ISSN： 1557-170X