Literature DB >> 17298020

Nanostructure fabrication by ultra-high-resolution environmental scanning electron microscopy.

Milos Toth1, Charlene J Lobo, W Ralph Knowles, Matthew R Phillips, Michael T Postek, András E Vladár.   

Abstract

Electron beam induced deposition (EBID) is a maskless nanofabrication technique capable of surpassing the resolution limits of resist-based lithography. However, EBID fabrication of functional nanostructures is limited by beam spread in bulk substrates, substrate charging, and delocalized film growth around deposits. Here, we overcome these problems by using environmental scanning electron microscopy (ESEM) to perform EBID and etching while eliminating charging artifacts at the nanoscale. Nanostructure morphology is tailored by slimming of deposits by ESEM imaging in the presence of a gaseous etch precursor and by pre-etching small features into a deposit (using a stationary or a scanned electron beam) prior to a final imaging process. The utility of this process is demonstrated by slimming of nanowires deposited by EBID, by the fabrication of gaps (between 4 and 7 nm wide) in the wires, and by the removal of thin films surrounding such nanowires. ESEM imaging provides a direct view of the slimming process, yielding process resolution that is limited by ESEM image resolution ( approximately 1 nm) and surface roughening occurring during etching.

Year:  2007        PMID: 17298020     DOI: 10.1021/nl062848c

Source DB:  PubMed          Journal:  Nano Lett        ISSN: 1530-6984            Impact factor:   11.189


  2 in total

Review 1.  Charged particle single nanometre manufacturing.

Authors:  Philip D Prewett; Cornelis W Hagen; Claudia Lenk; Steve Lenk; Marcus Kaestner; Tzvetan Ivanov; Ahmad Ahmad; Ivo W Rangelow; Xiaoqing Shi; Stuart A Boden; Alex P G Robinson; Dongxu Yang; Sangeetha Hari; Marijke Scotuzzi; Ejaz Huq
Journal:  Beilstein J Nanotechnol       Date:  2018-11-14       Impact factor: 3.649

2.  Combined Focused Electron Beam-Induced Deposition and Etching for the Patterning of Dense Lines without Interconnecting Material.

Authors:  Sangeetha Hari; P H F Trompenaars; J J L Mulders; Pieter Kruit; C W Hagen
Journal:  Micromachines (Basel)       Date:  2020-12-24       Impact factor: 2.891

  2 in total

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