Well-aligned open-ended carbon nanotube architectures: an approach for device assembly.

To circumvent the high carbon nanotube (CNT) growth temperature and poor adhesion with the substrates that currently plague CNT implementation, we proposed using CNT transfer technology enabled by open-ended CNTs. The process is featured with separation of CNT growth and CNT device assembly. Field emission testing of the as-assembled CNT devices is in good agreement with the Fowler-Nordheim (FN) equation, with a field enhancement factor of 4,540. This novel technique shows promising applications for positioning CNTs on temperature-sensitive substrates and for the fabrication of field emitters, electrical interconnects, and thermal management structures in microelectronics packaging.