Literature DB >> 15933187

Materials science. Electronics without lead.

Yi Li1, Kyoung-sik Moon, C P Wong.   

Abstract

In conventional consumer electronics such as cell phones, lead-containing interconnects provide the conductive path between different circuit elements. Environmental concerns have led to a search for lead-free alternatives. In their Perspective, Li et al. review these efforts, which have focused on lead-free alloys and electrically conductive adhesives. Both of these approaches are showing promise, but no one lead-free interconnect material can serve as a substitute for the conventional tin-lead solder in all devices.

Entities:  

Year:  2005        PMID: 15933187     DOI: 10.1126/science.1110168

Source DB:  PubMed          Journal:  Science        ISSN: 0036-8075            Impact factor:   47.728


  12 in total

1.  Magnetically driven three-dimensional manipulation and inductive heating of magnetic-dispersion containing metal alloys.

Authors:  Joshua D Calabro; Xu Huang; Brian G Lewis; Ainissa G Ramirez
Journal:  Proc Natl Acad Sci U S A       Date:  2010-03-01       Impact factor: 11.205

2.  Direct writing of flexible electronics through room temperature liquid metal ink.

Authors:  Yunxia Gao; Haiyan Li; Jing Liu
Journal:  PLoS One       Date:  2012-09-19       Impact factor: 3.240

3.  Getting the lead out of electronics.

Authors:  Harvey Black
Journal:  Environ Health Perspect       Date:  2005-10       Impact factor: 9.031

4.  Size effect model on kinetics of interfacial reaction between Sn-xAg-yCu solders and Cu substrate.

Authors:  M L Huang; F Yang
Journal:  Sci Rep       Date:  2014-11-19       Impact factor: 4.379

5.  Self-generated local heating induced nanojoining for room temperature pressureless flexible electronic packaging.

Authors:  Peng Peng; Anming Hu; Adrian P Gerlich; Yangai Liu; Y Norman Zhou
Journal:  Sci Rep       Date:  2015-03-19       Impact factor: 4.379

6.  Towards practical application of paper based printed circuits: capillarity effectively enhances conductivity of the thermoplastic electrically conductive adhesives.

Authors:  Haoyi Wu; Sum Wai Chiang; Wei Lin; Cheng Yang; Zhuo Li; Jingping Liu; Xiaoya Cui; Feiyu Kang; Ching Ping Wong
Journal:  Sci Rep       Date:  2014-09-03       Impact factor: 4.379

7.  Fractal dendrite-based electrically conductive composites for laser-scribed flexible circuits.

Authors:  Cheng Yang; Xiaoya Cui; Zhexu Zhang; Sum Wai Chiang; Wei Lin; Huan Duan; Jia Li; Feiyu Kang; Ching-Ping Wong
Journal:  Nat Commun       Date:  2015-09-03       Impact factor: 14.919

8.  Impact of technological innovation and regulation development on e-waste toxicity: a case study of waste mobile phones.

Authors:  Yu Chen; Mengjun Chen; Yungui Li; Bin Wang; Shu Chen; Zhonghui Xu
Journal:  Sci Rep       Date:  2018-05-08       Impact factor: 4.379

9.  A rigid and healable polymer cross-linked by weak but abundant Zn(II)-carboxylate interactions.

Authors:  Jian-Cheng Lai; Lan Li; Da-Peng Wang; Min-Hao Zhang; Sheng-Ran Mo; Xue Wang; Ke-Yu Zeng; Cheng-Hui Li; Qing Jiang; Xiao-Zeng You; Jing-Lin Zuo
Journal:  Nat Commun       Date:  2018-07-13       Impact factor: 14.919

10.  Self-Assembly Synthesis of Silver Nanowires/Graphene Nanocomposite and Its Effects on the Performance of Electrically Conductive Adhesive.

Authors:  Tao Xu; Jiayu Chen; Wenhui Yuan; Yinhua Liu; Yongjun Sun; Huijun Wu; Xiaoqing Zhou
Journal:  Materials (Basel)       Date:  2018-10-18       Impact factor: 3.623

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