| Literature DB >> 15933187 |
Yi Li1, Kyoung-sik Moon, C P Wong.
Abstract
In conventional consumer electronics such as cell phones, lead-containing interconnects provide the conductive path between different circuit elements. Environmental concerns have led to a search for lead-free alternatives. In their Perspective, Li et al. review these efforts, which have focused on lead-free alloys and electrically conductive adhesives. Both of these approaches are showing promise, but no one lead-free interconnect material can serve as a substitute for the conventional tin-lead solder in all devices.Entities:
Year: 2005 PMID: 15933187 DOI: 10.1126/science.1110168
Source DB: PubMed Journal: Science ISSN: 0036-8075 Impact factor: 47.728