Literature DB >> 15877419

Electropolymerization of vinylbipyridine complexes of ruthenium(II) and osmium(II) in SiO2 sol-gel films.

John Yang1, Milan Sykora, Thomas J Meyer.   

Abstract

PF(6)(-) salts of the complexes [Ru(vbpy)(3)](2+) and [Os(vbpy)(3)](2+) (vbpy = 4-methyl-4'-vinyl-2,2'-bipyridine) have been electropolymerized into the pores of SiO(2) sol-gel films deposited on conductive Tin(IV)-doped indium oxide-coated glass slides (ITO, In(2)O(3):Sn). The resulting transparent composites represent a new class of materials of general formulas ITO/SG-poly-[Ru(vbpy)(3)](PF(6))(2) and ITO/SG-poly-[Os(vbpy)(3)](PF(6))(2). The composites are stable with respect to loss of complexes to the external solution and demonstrate several interesting phenomena: (1) Sol-gel pores, serving as diffusion channels for the vbpy complexes and counterions, play a key role in the formation of the polymer and dictate the electrochemical properties of the resulting composite. (2) Dynamic polymer growth occurs within individual diffusion channels creating parallel structures of filled and unfilled channels. (3) Unidirectional charge transfer and a "bilayer" effect have been shown to operate in ITO/SG-poly-[Ru(vbpy)(3)](PF(6))(2) films exposed to [Os(vbpy)(3)](PF(6))(2) in the external solution. (4) Photophysical properties of the metal-to-ligand charge transfer (MLCT) excited states in ITO/SG-poly-[Ru(vbpy)(3)](PF(6))(2) composites are significantly modified compared to electropolymerized films on ITO or model monomeric complexes in solution.

Entities:  

Year:  2005        PMID: 15877419     DOI: 10.1021/ic048623r

Source DB:  PubMed          Journal:  Inorg Chem        ISSN: 0020-1669            Impact factor:   5.165


  1 in total

1.  Reductive electropolymerization of a vinyl-containing poly-pyridyl complex on glassy carbon and fluorine-doped tin oxide electrodes.

Authors:  Daniel P Harrison; Logan S Carpenter; Jacob T Hyde
Journal:  J Vis Exp       Date:  2015-01-30       Impact factor: 1.355

  1 in total

北京卡尤迪生物科技股份有限公司 © 2022-2023.