A kinetic model and its parameter estimation for the process of binding copper to human serum albumin by a voltammetric method.

Linear sweep anodic stripping voltammetry was applied to determine the concentration of free copper ions in the process of binding copper to human serum albumin (HSA) on the mercaptoethane sulfonate modified gold electrode surface. A kinetic model of two consecutive steps for the process of binding copper to HSA was first proposed on the basis of the electrochemical results and compared with a parallel kinetic response model by using residual analysis. The experimental data of the stripping peak currents with time was fitted according to the model and the kinetic parameters, binding rate constants, k1 and k2, were estimated to be 0.411 and 0.055 min(-1), respectively.