Literature DB >> 15756975

Studies on the reuse of waste printed circuit board as an additive for cement mortar.

Bong-Chan Ban1, Jong-Yoon Song, Joong-Yeon Lim, Soo-Kyoon Wang, Kwang-Guk An, Dong-Su Kim.   

Abstract

The recent development in electronic industries has generated a drastic increase in production of printed circuit boards (PCB). Accordingly, the amount of waste PCB from electronic productions and waste electronics and its environmental impact such as soil and groundwater contamination have become a great concern. This study aims to propose a method for reuse of waste PCB as an additive for cement mortar. Although the expansibility of waste PCB powder finer than 0.08 mm in water was observed to be greater than 2.0%, the maximum expansion rates in water for 0.08 to approximately 0.15 and 0.15 to approximately 0.30 mm sized PCB powders were less than 2.0%, which satisfied the necessary condition as an alternative additive for cement mortar in place of sand. The difference in the compressive strength of standard mortar and waste PCB added mortar was observed to be less than 10% and their difference was expected to be smaller after prolonged aging. The durability of waste PCB added cement mortar was also examined through dry/wet conditioning cyclic tests and acidic/alkaline conditioning tests. From the tests, both weight and compressive strength of cement mortar were observed to be recovered with aging. The leaching test for heavy metals from waste PCB added mortar showed that no heavy metal ions such as copper, lead, or cadmium were detected in the leachate, which resulted from fixation effect of the cement hydrates.

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Year:  2005        PMID: 15756975     DOI: 10.1081/ese-200046618

Source DB:  PubMed          Journal:  J Environ Sci Health A Tox Hazard Subst Environ Eng        ISSN: 1093-4529            Impact factor:   2.269


  1 in total

1.  Recycling Non-Metallic Powder of Waste Printed Circuit Boards to Improve the Performance of Asphalt Material.

Authors:  Sheng Li; Yu Sun; Shuo Fang; You Huang; Huanan Yu; Ji Ye
Journal:  Materials (Basel)       Date:  2022-06-12       Impact factor: 3.748

  1 in total

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