Literature DB >> 14737475

Effects of organic ligands and pH on the leaching of copper from brake wear debris in model environmental solutions.

Jin Hur1, Mark A Schlautman, Soobin Yim.   

Abstract

Copper leaching from a disc brake wear debris sample was examined in a variety of aqueous solutions to simulate potential leaching processes during rain events and in surface waters. Synthetic rainwater leached 40% of the total copper present in the brake wear debris into solution after 18 h in batch reactors, which was approximately three times more copper than that extracted by the US Environmental Protection Agency's Synthetic Precipitation Leaching Procedure. Formate and acetate were responsible for the enhanced copper leaching, as demonstrated by higher average amounts of leached copper in synthetic rainwater with- versus without the organic acids (40 versus 31% recovery). This observation suggests leaching tests that do not incorporate the appropriate types and concentrations of organic ligands present in rainwater will likely underestimate copper mobilization from brake wear debris during rain events. Leaching of copper from the brake wear debris ranged from 23 to 40% in solutions containing 3 to 15 mg C L(-1) dissolved humic substances, and was higher still in solutions containing relatively high concentrations of the synthetic metal chelating agent ethylenediaminetetraacetic acid. Static pH tests demonstrated that copper leaching from brake wear debris is highly pH dependent, with more leaching occurring at lower solution pH values. Leaching rate studies revealed that equilibrium generally was not attained within 48 h in the model solutions, indicating that additional copper can be expected to be released in environments where brake wear debris is exposed to long-term leaching processes.

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Year:  2003        PMID: 14737475     DOI: 10.1039/b310125h

Source DB:  PubMed          Journal:  J Environ Monit        ISSN: 1464-0325


  2 in total

1.  Sll0751 and Sll1041 are involved in acid stress tolerance in Synechocystis sp. PCC 6803.

Authors:  Hiroko Tahara; Ayumi Matsuhashi; Junji Uchiyama; Satoru Ogawa; Hisataka Ohta
Journal:  Photosynth Res       Date:  2015-05-08       Impact factor: 3.573

2.  Temperature and pH affect copper release kinetics from copper metal foil and commercial copperware to food simulants.

Authors:  John L Koontz; Girvin L Liggans; Benjamin W Redan
Journal:  Food Addit Contam Part A Chem Anal Control Expo Risk Assess       Date:  2020-01-08
  2 in total

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